Ceramic Leadless Package

A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package.

Ceramic leadless package.

The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in. Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount. Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc. The ceramic leadless chip carrier or clcc or lcc is a square or rectangular surface mount ceramic package that has no leads.

Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or. Commercial quasi hermetic smt package. For electrical connection to the outside world the lcc instead uses flat metal contacts or metallized castellations known as pads around the four sides of the package bottom. Lcc leadless ceramic e ey leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below.

Leadless smt ceramic packages and substrates feature consistent dielectric properties enhanced thermal management and improved reliability. Fully hermetic smt package. Daisy chain dummy components for machine evaluation solder training and rework practice. Lcc packages have pads on all four sides of the package.

Leadless ceramic carrier this surface mount package consists of a ceramic base that has metalized castellations pads on the sides and bottom of the package. Leaded chip carriers have metal leads wrapped around the edge of the package in the shape of a letter j. Lcc ceramic leadless chip carrier for silicon and mems. Leadless chip carriers have metal pads on the edges.

Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic.