Ceramic Hybrid Ic Packaging

Circular and slotted holes allow mechanical positioning.

Ceramic hybrid ic packaging.

Packaging and electronic assembly criteria labs offers a full array of ic packaging services from wafer dicing to assembly of gaas gan rf modules and high temperature mcm s. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance. In support of our defense customers we are an itar registered facility accredited trusted supplier and dla mil prf 38535 certified assembly mfg. Twenty mil thick ultra.

Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. Co 2 lasered ceramic with matching window frame. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Ic or integrated circuit packaging refers literally to the material that contains a semiconductor device.

Transistors diodes or monolithic ics and passive components e g. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and to allow for mounting of the electrical contacts connecting it to the pcb. 0 100 double row edge pinout. At the same time the vacuum tight housings and substrates must.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. A hybrid integrated circuit hic hybrid microcircuit hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices such as semiconductor devices e g. Other terms such as hybrid or hybrid. Plated holes enabling multiple conductor levels.

A multi chip module mcm is generically an electronic assembly such as a package with a number of conductor terminals or pins where multiple integrated circuits ics or chips semiconductor dies and or other discrete components are integrated usually onto a unifying substrate so that in use it can be treated as if it were a larger ic.