Ceramic Dip Package

Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.

Ceramic dip package.

Material properties process flow. Spst x 4 two complementary pairs per package. Spst x 4 two complementary pairs per package. And having a row spacing associated with body width varies depending on lead counts with 0 3 in.

Standard dip with 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm apart. 7 62 mm or 0 6 inch 15 24 mm. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Non standard dip with smaller 0 07 in 1 78 mm pin spacing.

Another example of a ceramic. Ceramic substrates for probe cards. Standard packages and lids for device evaluation. Both passive or active devices may be found using ceramic packages.

Packages come in many forms including dip dual inline sip single inline and pga pin grid array pin insertion types and surface mount types including j lead flat lead gull wing leadless bga ball grid array lga land grid array csp chip size package and other types. Minimum pin count is 28 while the maximum pin count is limited to the manufacturer s capabilities. Cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. The most commonly found ceramic dip packages have an inter lead spacing or lead pitch of 0 1 inch 2 54 mm.

14 lead cerdip q 14 pdf. Ceramic packages for large scale integration lsi devices. Cerdip ceramic q ceramic dual inline package glass seal package drawing q filter packages by entering lead count or product description into the search box below. Medical and healthcare.

Like dip but with staggered zig zag pins.