Ceramic Chip Carrier Package

Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below.

Ceramic chip carrier package.

Chelsea technology j lead chip carrier s feature. Ceramic materials facilitate miniaturization through their high strength rigidity and the cavity structures they make possible. The external lead frame is formed into a j shape to allow for socketing or direct board soldering. Kyocera provides standard and custom designed ceramic packages optically coated glasses and chip assembly services for ccd and cmos image sensors.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Lcc legacy ltc leadless ceramic chip carrier legacy ltc view more. Commercial quasi hermetic smt package. Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no.

Our inventory of ceramic quad flat packages range in size from 28 to 84 leads. Clcc ceramic leadless chip carrier mm inch unit. Plcc plastic leaded p. Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount.

Fully hermetic smt package. Lcc trays legacy ltc trays for lcc packages legacy ltc view more. Leaded ceramic chip carrier package drawing ej view more. Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or.

Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Various cavity sizes available to acccommodate small medium and large size die. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Package outline material information.

12 lead lcc 2 9mm x 2 9mm w ep e 12 4 pdf. 84 lead ceramic leadless chip carrier type c ns package number e84a 84 lead ceramic leadless chip carrier type b ns package number e84b life support policy national s products are not authorized for use as critical components in life support devices or systems without the express written approval of the president and general. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. 1st 2nd 3rd total seal ring die attach a x b c x d e x.

The external lead frame is formed into a j shape to allow.